Ieee Mb White

Keynote Speakers

Large-size nanoelectronics via additive manufacturing

King Abdullah University of Science and Technology (KAUST), KAUST Solar Centre, Division of Physical Sciences and Engineering, Kingdom of Saudi Arabia


Our ability to continuously downscale critical dimensions of the silicon transistor has proven extremely successful over the past sixty years in increasing the computational power of modern day microelectronics. The extraordinary developments have been achieved through a virtuous cycle of scientific and engineering breakthroughs which have led to the proliferation of a variety of electronic technologies with extraordinary impact on our society and personal lives. However, adopting silicon’s approach of size-downscaling to emerging technologies such as large-area electronics, and their implementation in the ever expanding range of emerging applications, has proven challenging both in terms of technology and economics. In this talk I will discuss recent work from our laboratory in downscaling emerging forms of large-area electronics and their use in various applications including sensing, energy harvesting and telecommunication. Emphasis will be placed on the use of advanced materials and alternative fabrication paradigms.

Flexible Electronics and Sensors: One Advocate’s Perspective

In this talk I will review the following topics to describe what, to me, are the key periods in the creation, development, current status, and possible future directions of flexible sensors and electronics.

  • Context for Flex Electronics & Sensors
    • The electronics industry in the 80s and 90s and organic electronics.
  • Early Motivations
    • What were some of the applications envisioned?
  • When/Where Does Printing Fit In
    • Could it provide a possible paradigm shift in fabrication technology?
  • Early Challenges & Limitations
    • What bottlenecks limited the successful implementation?
  • Early Successes
    • Setbacks, yes. But technical and commercial successes too!
  • Current Status
    • Progress being made, but challenges remain.
  • Opportunities and Future Directions
    • Changing electronics landscape suggests —– ?

Intelligent Packing by printing sensors on paper


Smart packaging and smart labels represent a huge potential market nowadays, and with the willingness to minimize the impact on environment and to target a circular economy, I will explain why printed electronics on paper is a good alternative versus other approaches.

In this talk, I will present the different strategies to manufacture smart packaging and review the different sensors that could be printed (temperature, pressure, humidity, open detection, bending, pH …) and how we can connect it, power it and get the data. Already commercialized examples will be given as well as research programs. The recyclability will also be analyzed on 2 real examples for a shock detection tags and an anticounterfeiting label on paper.

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